Umthombo wokukhanya we-COB kunye nomthombo wokukhanya we-LED, yeyiphi engcono?

Umthombo wokukhanya kwe-Cob kunye nomthombo wokukhanya we-LED yeyiphi engcono?

Isibane sixhaphake kakhulu kubomi bethu, ngophuhliso lwesayensi kunye netekhnoloji, zininzi iintlobo ezintsha zokukhanyisa.zineefuction ezininzi, kwaye zineentlobo ezininzi zemithombo yokukhanya.Umthombo wokukhanya weCoB ngowona umelweyo.Umthombo wokukhanya we-Cob ngumthombo wokukhanya ophezulu odibeneyo wokukhanya odibeneyo, odityaniswe ngokuthe ngqo kwi-chip ekhokelwayo kwisibuko sesinyithi esinexabiso eliphezulu lokubonisa, kwaye ayinayo i-electroplating, i-reflow welding kunye nenkqubo ye-SMT, ngoko ixabiso lomthombo wokukhanya we-COB ngaphezulu ngaphantsi.Kodwa kukho abahlobo abaninzi abangaqhelananga kakhulu nomthombo wokukhanya we-COB, ke mandikuxelele malunga nolwazi lomthombo wokukhanya we-COB.

Yintoni umthombo wokukhanya kweCob

Umthombo wokukhanya we-COB kukukhanya okuphezulu okudityanisiweyo komgangatho wetekhnoloji yomthombo wokukhanya oncamathisela ngokuthe ngqo i-chip ye-LED kwisibuko sesinyithi esinexabiso eliphezulu.Le teknoloji iphelisa ingcamango yesibiyeli, kwaye ayinayo i-electroplating, i-reflow welding kunye nenkqubo ye-SMT.Ngoko ke, inkqubo icuthwa phantse ngesinye kwisithathu kwaye iindleko nazo zigcinwa ngesinye kwisithathu.

Iimveliso eziphambili zokukhanya kwezikhwebu

Kukho iindlela ezimbini eziphambili zetekhnoloji yeChip engenanto: itekhnoloji yeCOB kunye neteknoloji yeFlip Chip.I-Chip kwi-board packaging (COB), i-semiconductor chip handover efakwe kwibhodi yesekethe eprintiweyo, i-chip kunye ne-substrate uxhumano lombane lwenziwa nge-lead suture method, kwaye ihlanganiswe ne-resin ukuqinisekisa ukuthembeka.

Inkqubo yokuvelisa umthombo wokukhanya kwezikhwebu

Inkqubo yeChip On Board (COB) kukugquma indawo yokubeka isilicon wafer nge thermally conductive epoxy resin (ngokubanzi isilivere doped epoxy resin) Kumphezulu we substrate, emva koko ubeke isilicon wafer ngqo phezu komphezulu we substrate. unyango lobushushu de i-silicon wafer iqiniswe ngokuqinileyo Kwi-substrate.Emva koko i-welding yocingo isetyenziselwa ukuseka uqhagamshelo lombane oluthe ngqo phakathi kwe-silicon wafer kunye ne-substrate.

light source

Umthombo wokukhanya kwe-Cob kunye nomthombo wokukhanya we-LED yeyiphi engcono?

I-LED yesiNtu: "Isixhobo esicacileyo somthombo wokukhanya we-LED →Imodyuli yomthombo wokukhanya we-MCPCB → izibane ze-LED", ikakhulu ngenxa yokuba akukho zixhobo zomthombo wokukhanya ezifanelekileyo, kungekuphela nje ixesha, kodwa neendleko eziphezulu.

 

Iphakheji "Imodyuli yomthombo wokukhanya we-COB → isibane se-LED", inokupakisha ngokuthe ngqo iitshiphusi ezininzi kwisiseko sentsimbi eprintiweyo yebhodi yesekethe ye-MCPCB, ngokusebenzisa i-substrate yokutshatyalaliswa kobushushu obuthe ngqo, gcina ixabiso lokupakishwa kwe-LED, iindleko zemodyuli ye-injini yokukhanya kunye neendleko zokusasazwa kokukhanya kwesibini.Ngokubhekiselele ekusebenzeni, imodyuli yomthombo wokukhanya we-COB inokuphepha ngokufanelekileyo imiqobo efana nokukhanya kwendawo kunye ne-glare ekhoyo ngokudibanisa izixhobo zomthombo wokukhanya ocacileyo ngoyilo olufanelekileyo kunye nokubumba i-microlens.Ukunikezelwa kombala komthombo wokukhanya kunokuphuculwa ngokufanelekileyo ngokudibanisa ukudibanisa okufanelekileyo kweetshiphusi ezibomvu ngaphandle kokunciphisa kakhulu ukusebenza kakuhle kunye nobomi bomthombo wokukhanya.

Iinzuzo ezinxulumeneyo zezi:

Inzuzo yokwenziwa kakuhle kwemveliso

Inkqubo yemveliso yokupakishwa ngokusisiseko iyafana naleyo yenkqubo yemveli yokuvelisa i-SMD.Ukusebenza kakuhle kwe-PACKAGING ngokusisiseko kuyafana naleyo ye-SMD kwinkqubo yekristale eqinileyo kunye nomgca we-welding.Nangona kunjalo, ukusebenza kakuhle kokupakishwa kwe-COB kuphezulu kakhulu kuneemveliso ze-SMD kwimiba yokuhambisa, ukwahlukana, ukwahlula kunye nokupakisha.I-COB yokupakishwa kweendleko zabasebenzi kunye neendleko zokuvelisa malunga ne-10% yeendleko eziphathekayo, ukusebenzisa i-COB yokupakisha, iindleko zabasebenzi kunye nokuvelisa kunokugcina i-5%.

Umthombo wokukhanya

k-cob

K-COB LIGHT SOURCE

Ukupakishwa kwe-SMD yesiNtu kusebenzisa imo yeepetshi ukuncamathisela amacandelo amaninzi adityanisiweyo kwiibhodi zePCB ukwenza amacandelo omthombo wokukhanya kwizicelo ze-LED.Le ndlela ineengxaki zokukhanya kwamabala, ilitha kunye nokukhanya.Iphakheji ye-K-COB yiphakheji edibeneyo, engumthombo wokukhanya komhlaba, kunye ne-Angle enkulu yokujonga kunye nokulungelelaniswa okulula, ukunciphisa ukulahleka kokukhanya okukhanyelayo. iitshiphusi ezibomvu ngaphandle kokunciphisa kakhulu ukusebenza kakuhle kunye nobomi bomthombo wokukhanya.

k-cob structure

Oku ngasentla kukwabelana nawe ngolwazi olusisiseko lomthombo wokukhanya we-COB, ndiyathemba ukuba unokuqonda ngcono umthombo wokukhanya we-COB ngokwabelana kwethu.Umthombo wokukhanya we-K-cob, ophuhliswe kwaye waveliswa yinkampani yethu - SFUJIAN CAS-CERAMICS OPTOELECTRONICS Co.,Ltd.

I-K-COB inokuqondwa ngokulula njengomthombo wokukhanya wamandla aphezulu adityanisiweyo, kwaye uphawu lwayo olukhulu luxabiso eliphantsi, kulula ukuyisebenzisa, ukutshatyalaliswa kobushushu kunye nokukhanya kwezenzululwazi kakhulu, ngoko ke umthombo wokukhanya we-K-COB uya uqondwa ngakumbi nguye wonke umntu.Kwaye ngoku uninzi lomthombo wokukhanya osetyenziselwa ukukhanyisa ngumthombo wokukhanya we-COB, ongenawo umphumo omuhle wokukhanyisa, kodwa ugcina amandla.


Ixesha lokuposa: Mar-29-2022
Shiya uMyalezo Wakho
Bhala umyalezo wakho apha kwaye uwuthumele kuthi